Plasma Etching Equipment - Company Ranking(6 companies in total)
Last Updated： Aggregation Period:Sep 02, 2026〜Sep 29, 2026
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| Atmospheric transport type CtoC system compatible with 3 to 8-inch wafers. Based on a parallel plate RIE device, it achieves soft mode plasm... | Power device ashing Discrete IC etching (removal of natural oxide film, pre-treatment before electrode formation) MEMS device ashing and... | ||
| Standard Specifications Stage Dimensions: 250 mm□ Etching Method: RIE CF Gas Standard Simple mechanism allows switching between RIE/DP... | MEMS sensor etching: SiN SiO2, Si Electronic component etching: SiO2 Pre-deposition light etching of semiconductor wafers (removal of na... | ||
| A high-density plasma etching device with a simple structure. It is easy to accommodate larger diameters and is suitable for processing wafe... | Etching of wafers over 200 mm, Si, Si nitride film, oxide film, metal film, organic film, photoresist removal, photo mask etching, large hig... | ||
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神港精機 東京支店
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- Featured Products
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Single-wafer plasma etching device "EXAM-Σ"
- overview
- Atmospheric transport type CtoC system compatible with 3 to 8-inch wafers. Based on a parallel plate RIE device, it achieves soft mode plasm...
- Application/Performance example
- Power device ashing Discrete IC etching (removal of natural oxide film, pre-treatment before electrode formation) MEMS device ashing and...
Plasma etching device "EXAM" sample testing now accepting applications.
- overview
- Standard Specifications Stage Dimensions: 250 mm□ Etching Method: RIE CF Gas Standard Simple mechanism allows switching between RIE/DP...
- Application/Performance example
- MEMS sensor etching: SiN SiO2, Si Electronic component etching: SiO2 Pre-deposition light etching of semiconductor wafers (removal of na...
HCD type high-density plasma etching device
- overview
- A high-density plasma etching device with a simple structure. It is easy to accommodate larger diameters and is suitable for processing wafe...
- Application/Performance example
- Etching of wafers over 200 mm, Si, Si nitride film, oxide film, metal film, organic film, photoresist removal, photo mask etching, large hig...
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神港精機 東京支店
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